ICS 31
电子学
共 1,114 项 ISO/IEC 标准 · 合计 18.6 GB · 分 56 页展示
二级分类
IEC 61189-5-2:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods…
现行
31.180 印制电路和印制电路板
2015
83 页
¥5
IEC 61189-5-301:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test…
现行
31.180 印制电路和印制电路板
2021
64 页
¥5
IEC 61189-5-3:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods…
现行
31.180 印制电路和印制电路板
2015
79 页
¥5
IEC 61189-5-4:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods…
现行
31.180 印制电路和印制电路板
2015
45 页
¥3
IEC 61189-5-501:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test…
现行
31.180 印制电路和印制电路板
2021
37 页
¥2
IEC 61189-5-502:2021
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods…
现行
31.180 印制电路和印制电路板
2021
45 页
¥3
IEC 61189-5-503:2017
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method…
现行
31.180 印制电路和印制电路板
2017
23 页
¥2
IEC 61189-5-504:2020
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test…
现行
31.180 印制电路和印制电路板
2020
49 页
¥3
IEC 61189-5-601:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test…
现行
31.180 印制电路和印制电路板
2021
80 页
¥5
IEC 61190-1-2:2014
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics…
现行
31.190 电子元器件组件
2014
46 页
¥3
IEC 61190-1-3:2017
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid…
现行
31.190 电子元器件组件
2017
86 页
¥5
IEC 61191-1:2018 RLV
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface…
现行
31.240 电子设备用机械构件
2018
140 页
¥5
IEC 61191-2:2017/COR1:2019
Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
现行
31.240 电子设备用机械构件
2017
1 页
¥1
IEC 61191-3:2017
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
现行
31.240 电子设备用机械构件
2017
20 页
¥1
IEC 61191-4:2017
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
现行
31.240 电子设备用机械构件
2017
19 页
¥1
IEC 61191-6:2010
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
现行
31.180 印制电路和印制电路板
2010
76 页
¥5
IEC 61193-2:2007
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
现行
31.190 电子元器件组件
2007
18 页
¥1
IEC 61193-3:2013
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
现行
31.190 电子元器件组件
2013
136 页
¥5
IEC 61240:2016
Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
现行
31.140 频率控制和选择用压电器件与介…
2016
18 页
¥1
IEC 61249-2-10:2003
Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester,…
现行
31.180 印制电路和印制电路板
2003
45 页
¥3
关于 ICS 31 电子学
ICS 31 是 ICS 分类法中的一级大类,中文名称"电子学",本站收录该分类下的 ISO 与 IEC 国际标准共 1,114 项,覆盖 14 个二级类目。
这一分类下的标准以电子元器件综合、电阻器、电容器等方向为主。如果只需要其中一两份,可以进入详情页按页数单份购买;如果需要成批使用,整包获取更省事——¥199 可获得该分类全部标准的云盘分享,在云盘页面一键打包下载。
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