ICS 31
电子学
共 1,114 项 ISO/IEC 标准 · 合计 18.6 GB · 分 56 页展示
二级分类
IEC 60191-2V:1998
Twentieth supplement
现行
31.080 半导体分立器件
1998
23 页
¥2
IEC 60191-2X:1999/COR1:2000
Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
现行
31.080 半导体分立器件
1999
¥3
IEC 60191-3:1999
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
现行
31.080 半导体分立器件
1999
113 页
¥5
IEC 60191-5:1997
Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated…
现行
31.080 半导体分立器件
1997
71 页
¥5
IEC 60191-6-12:2011
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted…
现行
31.080 半导体分立器件
2011
37 页
¥2
IEC 60191-6-13:2016
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array…
现行
31.080 半导体分立器件
2016
36 页
¥2
IEC 60191-6-16:2007
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and…
现行
31.080 半导体分立器件
2007
11 页
¥1
IEC 60191-6-17:2011
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted…
现行
31.080 半导体分立器件
2011
53 页
¥3
IEC 60191-6-19:2010
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the…
现行
31.080 半导体分立器件
2010
25 页
¥2
IEC 60191-6-20:2010
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted…
现行
31.080 半导体分立器件
2010
21 页
¥2
IEC 60191-6-21:2010
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted…
现行
31.080 半导体分立器件
2010
28 页
¥2
IEC 60191-6-22:2012
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted…
现行
31.080 半导体分立器件
2012
34 页
¥2
IEC 60191-6-3:2000
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted…
现行
31.080 半导体分立器件
2000
34 页
¥2
IEC 60191-6:2009
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted…
现行
31.080 半导体分立器件
2009
76 页
¥5
IEC 60194-2:2017
Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and…
现行
31.190 电子元器件组件
2017
45 页
¥3
IEC 60194-2:2025
Electronic assembly, design and circuit boards - Vocabulary - Part 2: Common usage in electronic technologies as well as electronic…
现行
31.190 电子元器件组件
2025
45 页
¥3
IEC 60195:2016
Method of measurement of current noise generated in fixed resistors
现行
31.040 电阻器
2016
58 页
¥3
IEC 60235-2A:1974
Measurement of the electrical properties of microwave tubes - Part 2: General measurements - Chapter V: Methods of measuring parasitic noise
现行
31.100 电子管
1974
57 页
¥3
IEC 60235-2B:1975
Measurement of the electrical properties of microwave tubes - Part 2: General measurements - Second supplement
现行
31.100 电子管
1975
34 页
¥2
IEC 60235-2C:1976
Measurement of the electrical properties of microwave tubes - Part 2: General measurements - Third supplement
现行
31.100 电子管
1976
30 页
¥2
关于 ICS 31 电子学
ICS 31 是 ICS 分类法中的一级大类，中文名称"电子学"，本站收录该分类下的 ISO 与 IEC 国际标准共 1,114 项，覆盖 14 个二级类目。
这一分类下的标准以电子元器件综合、电阻器、电容器等方向为主。如果只需要其中一两份，可以进入详情页按页数单份购买；如果需要成批使用，整包获取更省事——¥199 可获得该分类全部标准的云盘分享，在云盘页面一键打包下载。
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