Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
文件核验信息（付费前可核对）
标准范围（官方英文摘要）
IEC 60749-23:2025 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.
IEC 60749-23:2025 specifies the test used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as "burn-in", can be used to screen for infant-mortality related failures. The detailed use and application of burn-in is outside the scope of this document.
This edition includes the following significant technical changes with respect to the previous edition:
a) absolute stress test definitions and resultant test durations have been updated.
标准信息
- 标准号
- IEC 60749-23:2025 RLV
- 英文标题
- Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
- 发布单位
- —
- 技术委员会
- TC 47
- 版本 / 版次
- 2.0
- 状态
- 现行
- 发布日期
- 2025
- ICS 分类
- 31.080.01 半导体分立器件综合
- 页数
- 29 页
- 官方定价
- CHF 68
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