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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assemblies

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method

Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages

Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing

Characteristic parameters of stand-alone photovoltaic (PV) systems

Coaxial communication cables - Part 1-100: Electrical test methods - General requirements

Coaxial communication cables - Part 1-101: Electrical test methods - Test for conductor d.c. resistance of cable

Coaxial communication cables - Part 1-101: Electrical test methods - Test for conductor DC resistance of cable

Coaxial communication cables - Part 1-102: Electrical test methods - Test for insulation resistance of cable dielectric

Coaxial communication cables - Part 1-102: Electrical test methods - Test for insulation resistance of cable dielectric