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IEC 61249-4-11:2005
Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability
现行
ICS 31 电子学
2005
25 页
¥2
IEC 61249-4-12:2005
Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability
现行
ICS 31 电子学
2005
25 页
¥2
IEC 61249-4-14:2009
Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
现行
ICS 31 电子学
2009
28 页
¥2
IEC 61249-4-15:2009
Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
现行
ICS 31 电子学
2009
28 页
¥2
IEC 61249-4-16:2009
Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
现行
ICS 31 电子学
2009
14 页
¥1
IEC 61249-4-17:2009
Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
现行
ICS 31 电子学
2009
14 页
¥1
IEC 61249-4-18:2013
Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
现行
ICS 31 电子学
2013
29 页
¥2
IEC 61249-4-19:2013
Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
现行
ICS 31 电子学
2013
29 页
¥2
IEC 61249-4-1:2008
Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
现行
ICS 31 电子学
2008
25 页
¥2
IEC 61249-4-2:2005
Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability
现行
ICS 31 电子学
2005
12 页
¥1
IEC 61249-4-5:2005
Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability
现行
ICS 31 电子学
2005
13 页
¥1
IEC 61249-5-1:1995
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
现行
ICS 31 电子学
1995
39 页
¥2
IEC 61249-5-4:1996
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks
现行
ICS 31 电子学
1996
27 页
¥2
IEC 61249-6-3:2023
Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards
现行
ICS 31 电子学
2023
42 页
¥3
IEC 61249-7-1:1995
Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/invar/copper
现行
ICS 31 电子学
1995
13 页
¥1
IEC 61249-8-7:1996
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks
现行
ICS 31 电子学
1996
27 页
¥2
IEC 61249-8-8:1997
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
现行
ICS 31 电子学
1997
19 页
¥1
IEC 61250:1994
Nuclear reactors - Instrumentation and control systems important for safety - Detection of leakage in coolant systems
现行
ICS 27 能源和热传导工程
1994
29 页
¥2
IEC 61251:2015
Electrical insulating materials and systems - AC voltage endurance evaluation
现行
ICS 29 电气工程
2015
42 页
¥3
IEC 61252:2025
Electroacoustics - Personal sound exposure meters
现行
ICS 17 计量学和测量、物理现象
2025
50 页
¥3