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Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies

Electronic assembly, design and circuit boards - Vocabulary - Part 2: Common usage in electronic technologies as well as electronic assembly technologies

Method of measurement of current noise generated in fixed resistors

IEC standard frequencies

High-voltage connecting wire with flame retarding insulation for use in television receivers

Safety of machinery - Electrical equipment of machines - Part 11: Requirements for equipment for voltages above 1 000 V AC or 1 500 V DC and not exceeding 36 kV

Amendment 1 - Safety of machinery - Electrical equipment of machines - Part 1: General requirements

Safety of machinery - Electrical equipment of machines - Part 31: Particular safety and EMC requirements for sewing machines, units and systems

Safety of machinery - Electrical equipment of machines - Part 32: Requirements for hoisting machines

Safety of machinery - Electrical equipment of machines - ALL PARTS

Corrigendum 1 - Calculation of the effective parameters of magnetic piece parts

Calculation of the effective parameters of magnetic piece parts

Standard conditions for use prior to and during the testing of solid electrical insulating materials