标准检索

Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect

Integrated circuits - Three dimensional integrated circuits - Part 3: Model and measurement conditions of through-silicon via

Insulating liquids - Unused modified or blended esters for electrotechnical applications

LED packages - Long-term luminous, radiant and photon flux maintenance

Requirements for automatic reclosing devices (ARDs) for circuit breakers, RCBOs-RCCBs for household and similar uses

Submarine power cables with extruded insulation and their accessories for rated voltages from 6 kV (<em>U</em>_m = 7,2 kV) up to 60 kV (<em>U</em>_m = 72,5 kV) - Test methods and requirements

Photovoltaic power systems - DC arc detection and interruption

Wireless power transfer - Airfuel alliance resonant baseline system specification (BSS)

Corrigendum 1 - Audio, video multimedia systems and equipment - Multimedia e-publishing and e-book technologies - Raster-graphics image-based e-books

Fibre optic interconnecting devices and passive components - Fibre optic tuneable bandpass filters - Generic specification

Multimedia systems and equipment for vehicles - Surround view system - Part 1: General

Multimedia Systems and equipment for vehicle - Surround view system - Part 2: Recording methods of the surround view system

Multimedia systems and equipment for vehicles - Surround view system - Part 3: Measurement methods

Multimedia systems and equipment for vehicles - Surround view system - Part 4: Application for camera monitor systems

Microspeakers

MIDI (musical instrument digital interface) specification 1.0 (Abridged Edition, 2015)

Piezoelectric sensors - Part 1: Generic specifications

Piezoelectric sensors - Part 2: Chemical and biochemical sensors

Piezoelectric sensors - Part 3: Physical sensors

Piezoelectric sensors - Part 3: Physical sensors