ICS 31
电子学
共 1,114 项 ISO/IEC 标准 · 合计 18.6 GB · 分 56 页展示
二级分类
IEC 61988-4-1:2015
Plasma display panels - Part 4-1: Environmental testing methods - Climatic and mechanical
现行
31.260 光电子学、激光设备
2015
27 页
¥2
IEC 61988-4-2:2012
Plasma display panels - Part 4-2: Environmental testing methods - Panel strength
现行
31.260 光电子学、激光设备
2012
28 页
¥2
IEC 61988-4:2007
Plasma display panels - Part 4: Climatic and mechanical testing methods
被代替
31.260 光电子学、激光设备
2007
40 页
¥2
IEC 61988-5:2009
Plasma display panels - Part 5: Generic specification
现行
31.260 光电子学、激光设备
2009
46 页
¥3
IEC 62031:2018
LED modules for general lighting - Safety specifications
现行
31.080 半导体分立器件
2018
46 页
¥3
IEC 62031:2026
LED modules - Safety requirements
现行
31.080 半导体分立器件
2026
46 页
¥3
IEC 62047-11:2013
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of…
现行
31.080 半导体分立器件
2013
38 页
¥2
IEC 62047-12:2011
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant…
现行
31.080 半导体分立器件
2011
59 页
¥3
IEC 62047-13:2012
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for…
现行
31.080 半导体分立器件
2012
30 页
¥2
IEC 62047-14:2012
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
现行
31.080 半导体分立器件
2012
34 页
¥2
IEC 62047-16:2015
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer…
现行
31.080 半导体分立器件
2015
21 页
¥2
IEC 62047-17:2015
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
现行
31.080 半导体分立器件
2015
54 页
¥3
IEC 62047-18:2013
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
现行
31.080 半导体分立器件
2013
26 页
¥2
IEC 62047-19:2013
Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
现行
31.080 半导体分立器件
2013
60 页
¥3
IEC 62047-1:2016
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
现行
31.080 半导体分立器件
2016
66 页
¥5
IEC 62047-20:2014
Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
现行
31.080 半导体分立器件
2014
108 页
¥5
IEC 62047-21:2014
Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
现行
31.080 半导体分立器件
2014
26 页
¥2
IEC 62047-22:2014
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on…
现行
31.080 半导体分立器件
2014
20 页
¥1
IEC 62047-25:2016
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of…
现行
31.080 半导体分立器件
2016
45 页
¥3
IEC 62047-26:2016
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle…
现行
31.080 半导体分立器件
2016
57 页
¥3
关于 ICS 31 电子学
ICS 31 是 ICS 分类法中的一级大类，中文名称"电子学"，本站收录该分类下的 ISO 与 IEC 国际标准共 1,114 项，覆盖 14 个二级类目。
这一分类下的标准以电子元器件综合、电阻器、电容器等方向为主。如果只需要其中一两份，可以进入详情页按页数单份购买；如果需要成批使用，整包获取更省事——¥199 可获得该分类全部标准的云盘分享，在云盘页面一键打包下载。
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