ICS 31
电子学
共 1,114 项 ISO/IEC 标准 · 合计 18.6 GB · 分 56 页展示
二级分类
IEC 62047-27:2017
Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using…
现行
31.080 半导体分立器件
2017
16 页
¥1
IEC 62047-28:2017
Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy…
现行
31.080 半导体分立器件
2017
17 页
¥1
IEC 62047-29:2017
Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive…
现行
31.080 半导体分立器件
2017
12 页
¥1
IEC 62047-2:2006
Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
现行
31.080 半导体分立器件
2006
25 页
¥2
IEC 62047-30:2017
Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of…
现行
31.140 频率控制和选择用压电器件与介…
2017
20 页
¥1
IEC 62047-31:2019
Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of…
现行
31.080 半导体分立器件
2019
12 页
¥1
IEC 62047-32:2019
Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonlinear vibration of MEMS resonators
现行
31.080 半导体分立器件
2019
37 页
¥2
IEC 62047-33:2019
Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device
现行
31.140 频率控制和选择用压电器件与介…
2019
24 页
¥2
IEC 62047-34:2019
Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for MEMS piezoresistive pressure-sensitive device on wafer
现行
31.140 频率控制和选择用压电器件与介…
2019
16 页
¥1
IEC 62047-35:2019
Semiconductor devices – Micro-electromechanical devices - Part 35: Test method of electrical characteristics under bending deformation for…
现行
31.080 半导体分立器件
2019
41 页
¥3
IEC 62047-36:2019
Semiconductor devices – Micro-electromechanical devices – Part 36: Environmental and dielectric withstand test methods for MEMS…
现行
31.140 频率控制和选择用压电器件与介…
2019
16 页
¥1
IEC 62047-37:2020
Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor…
现行
31.140 频率控制和选择用压电器件与介…
2020
34 页
¥2
IEC 62047-38:2021
Semiconductor devices - Micro-electromechanical devices - Part 38: Test method for adhesion strength of metal powder paste in MEMS…
现行
31.080 半导体分立器件
2021
12 页
¥1
IEC 62047-3:2006
Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
现行
31.080 半导体分立器件
2006
15 页
¥1
IEC 62047-40:2021
Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of micro-electromechanical inertial shock switch threshold
现行
31.080 半导体分立器件
2021
11 页
¥1
IEC 62047-41:2021
Semiconductor devices - Micro-electromechanical devices - Part 41: RF MEMS circulators and isolators
现行
31.080 半导体分立器件
2021
65 页
¥5
IEC 62047-42:2022
Semiconductor devices - Micro-electromechanical devices - Part 42: Measurement methods of electro-mechanical conversion characteristics of…
现行
31.080 半导体分立器件
2022
22 页
¥2
IEC 62047-43:2024
Semiconductor devices - Micro-electromechanical devices - Part 43: Test method of electrical characteristics after cyclic bending…
现行
31.080 半导体分立器件
2024
18 页
¥1
IEC 62047-44:2024
Semiconductor devices - Micro-electromechanical devices - Part 44: Test methods for dynamic performances of MEMS resonant…
现行
31.080 半导体分立器件
2024
19 页
¥1
IEC 62047-45:2025
Semiconductor devices - Micro-electromechanical devices - Part 45: Silicon based MEMS fabrication technology - Measurement method of impact…
现行
31.080 半导体分立器件
2025
15 页
¥1
关于 ICS 31 电子学
ICS 31 是 ICS 分类法中的一级大类，中文名称"电子学"，本站收录该分类下的 ISO 与 IEC 国际标准共 1,114 项，覆盖 14 个二级类目。
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