首页 / 标准检索
标准检索
共找到 26,879 项标准，第 207 / 1344 页
IEC 62037-7:2022
Passive RF and microwave devices, intermodulation level measurement - Part 7: Field measurements of passive intermodulation
现行
ICS 33 电信、音频和视频工程
2022
22 页
¥2
IEC 62037-8:2022
Passive RF and microwave devices, intermodulation level measurement - Part 8: Measurement of passive intermodulation generated by objects exposed to RF radiation
现行
ICS 33 电信、音频和视频工程
2022
22 页
¥2
IEC 62037-8:2025 RLV
Passive RF and microwave devices, intermodulation level measurement - Part 8: Measurement of passive intermodulation generated by objects exposed to RF radiation
现行
ICS 33 电信、音频和视频工程
2025
37 页
¥2
IEC 62040-1:2017+AMD1:2021+AMD2:2022 CSV
Uninterruptible power systems (UPS) - Part 1: Safety requirements
现行
ICS 29 电气工程
2017
294 页
¥5
IEC 62040-1:2017/AMD2:2022
Amendment 2 - Uninterruptible power systems (UPS) - Part 1: Safety requirements
现行
ICS 29 电气工程
2017
5 页
¥1
IEC 62040-2:2016/ISH1:2018
Interpretation sheet 1 - Uninterruptible power systems (UPS) - Part 2: Electromagnetic compatibility (EMC) requirements
现行
ICS 33 电信、音频和视频工程
2016
3 页
¥1
IEC 62040-3:2021
Uninterruptible power systems (UPS) - Part 3: Method of specifying the performance and test requirements
现行
ICS 29 电气工程
2021
193 页
¥5
IEC 62040-4:2013
Uninterruptible power systems (UPS) - Part 4: Environmental aspects - Requirements and reporting
现行
ICS 29 电气工程
2013
34 页
¥2
IEC 62040-5-3:2016
Uninterruptible power systems (UPS) - Part 5-3: DC output UPS - Performance and test requirements
现行
ICS 29 电气工程
2016
133 页
¥5
IEC 62041:2017
Transformers, power supplies, reactors and similar products - EMC requirements
现行
ICS 33 电信、音频和视频工程
2017
30 页
¥2
IEC 62044-3:2023 RLV
Cores made of soft magnetic materials - Measuring methods - Part 3: Magnetic properties at high excitation level
现行
ICS 29 电气工程
2023
143 页
¥5
IEC 62046:2018
Safety of machinery - Application of protective equipment to detect the presence of persons
现行
ICS 13 环保、保健和安全
2018
91 页
¥5
IEC 62046:2026
Safety of machinery - Application of protective equipment to detect the presence of persons
现行
ICS 13 环保、保健和安全
2026
262 页
¥5
IEC 62047-11:2013
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
现行
ICS 31 电子学
2013
38 页
¥2
IEC 62047-12:2011
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
现行
ICS 31 电子学
2011
59 页
¥3
IEC 62047-13:2012
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
现行
ICS 31 电子学
2012
30 页
¥2
IEC 62047-14:2012
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
现行
ICS 31 电子学
2012
34 页
¥2
IEC 62047-16:2015
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
现行
ICS 31 电子学
2015
21 页
¥2
IEC 62047-17:2015
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
现行
ICS 31 电子学
2015
54 页
¥3
IEC 62047-18:2013
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
现行
ICS 31 电子学
2013
26 页
¥2