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IEC 62047-3:2006
Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
现行 ICS 31 电子学 2006 15 页 ¥1
IEC 62047-40:2021
Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of micro-electromechanical inertial shock switch threshold
现行 ICS 31 电子学 2021 11 页 ¥1
IEC 62047-41:2021
Semiconductor devices - Micro-electromechanical devices - Part 41: RF MEMS circulators and isolators
现行 ICS 31 电子学 2021 65 页 ¥5
IEC 62047-42:2022
Semiconductor devices - Micro-electromechanical devices - Part 42: Measurement methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever
现行 ICS 31 电子学 2022 22 页 ¥2
IEC 62047-43:2024
Semiconductor devices - Micro-electromechanical devices - Part 43: Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices
现行 ICS 31 电子学 2024 18 页 ¥1
IEC 62047-44:2024
Semiconductor devices - Micro-electromechanical devices - Part 44: Test methods for dynamic performances of MEMS resonant electric-field-sensitive devices
现行 ICS 31 电子学 2024 19 页 ¥1
IEC 62047-45:2025
Semiconductor devices - Micro-electromechanical devices - Part 45: Silicon based MEMS fabrication technology - Measurement method of impact resistance of nanostructures
现行 ICS 31 电子学 2025 15 页 ¥1
IEC 62047-46:2025
Semiconductor devices - Micro-electromechanical devices - Part 46: Silicon based MEMS fabrication technology - Measurement method of tensile strength of nanoscale thickness membrane
现行 ICS 31 电子学 2025 15 页 ¥1
IEC 62047-47:2024
Semiconductor devices - Micro-electromechanical devices - Part 47: Silicon based MEMS fabrication technology - Measurement method of bending strength of microstructures
现行 ICS 31 电子学 2024 16 页 ¥1
IEC 62047-48:2024
Semiconductor devices - Micro-electromechanical devices - Part 48: Test method for determining solution concentration by optical absorption using MEMS fluidic device
现行 ICS 31 电子学 2024 16 页 ¥1
IEC 62047-49:2025
Semiconductor devices - Micro-electromechanical devices - Part 49: Temperature and humidity test methods for piezoelectric MEMS cantilevers
现行 ICS 31 电子学 2025 8 页 ¥1
IEC 62047-4:2008
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
现行 ICS 31 电子学 2008 38 页 ¥2
IEC 62047-4:2026 RLV
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
现行 ICS 31 电子学 2026 39 页 ¥2
IEC 62047-50:2025
Semiconductor devices - Micro-electromechanical devices - Part 50: MEMS capacitive microphones
现行 ICS 31 电子学 2025 13 页 ¥1
IEC 62047-52:2026
Semiconductor devices - Micro-electromechanical devices - Part 52: Biaxial tensile testing method for stretchable MEMS
现行 ICS 31 电子学 2026 12 页 ¥1
IEC 62047-53:2025
Semiconductor devices - Micro-electromechanical devices - Part 53: MEMS electrothermal transfer device
现行 ICS 31 电子学 2025 14 页 ¥1
IEC 62047-6:2009
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
现行 ICS 31 电子学 2009 30 页 ¥2
IEC 62047-7:2011
Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
现行 ICS 31 电子学 2011 56 页 ¥3
IEC 62047-8:2011
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
现行 ICS 31 电子学 2011 36 页 ¥2
IEC 62052-11:2020
Electricity metering equipment - General requirements, tests and test conditions - Part 11: Metering equipment
现行 ICS 17 计量学和测量、物理现象 2020 119 页 ¥5