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IEC 62047-3:2006
Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
现行
ICS 31 电子学
2006
15 页
¥1
IEC 62047-40:2021
Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of micro-electromechanical inertial shock switch threshold
现行
ICS 31 电子学
2021
11 页
¥1
IEC 62047-41:2021
Semiconductor devices - Micro-electromechanical devices - Part 41: RF MEMS circulators and isolators
现行
ICS 31 电子学
2021
65 页
¥5
IEC 62047-42:2022
Semiconductor devices - Micro-electromechanical devices - Part 42: Measurement methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever
现行
ICS 31 电子学
2022
22 页
¥2
IEC 62047-43:2024
Semiconductor devices - Micro-electromechanical devices - Part 43: Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices
现行
ICS 31 电子学
2024
18 页
¥1
IEC 62047-44:2024
Semiconductor devices - Micro-electromechanical devices - Part 44: Test methods for dynamic performances of MEMS resonant electric-field-sensitive devices
现行
ICS 31 电子学
2024
19 页
¥1
IEC 62047-45:2025
Semiconductor devices - Micro-electromechanical devices - Part 45: Silicon based MEMS fabrication technology - Measurement method of impact resistance of nanostructures
现行
ICS 31 电子学
2025
15 页
¥1
IEC 62047-46:2025
Semiconductor devices - Micro-electromechanical devices - Part 46: Silicon based MEMS fabrication technology - Measurement method of tensile strength of nanoscale thickness membrane
现行
ICS 31 电子学
2025
15 页
¥1
IEC 62047-47:2024
Semiconductor devices - Micro-electromechanical devices - Part 47: Silicon based MEMS fabrication technology - Measurement method of bending strength of microstructures
现行
ICS 31 电子学
2024
16 页
¥1
IEC 62047-48:2024
Semiconductor devices - Micro-electromechanical devices - Part 48: Test method for determining solution concentration by optical absorption using MEMS fluidic device
现行
ICS 31 电子学
2024
16 页
¥1
IEC 62047-49:2025
Semiconductor devices - Micro-electromechanical devices - Part 49: Temperature and humidity test methods for piezoelectric MEMS cantilevers
现行
ICS 31 电子学
2025
8 页
¥1
IEC 62047-4:2008
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
现行
ICS 31 电子学
2008
38 页
¥2
IEC 62047-4:2026 RLV
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
现行
ICS 31 电子学
2026
39 页
¥2
IEC 62047-50:2025
Semiconductor devices - Micro-electromechanical devices - Part 50: MEMS capacitive microphones
现行
ICS 31 电子学
2025
13 页
¥1
IEC 62047-52:2026
Semiconductor devices - Micro-electromechanical devices - Part 52: Biaxial tensile testing method for stretchable MEMS
现行
ICS 31 电子学
2026
12 页
¥1
IEC 62047-53:2025
Semiconductor devices - Micro-electromechanical devices - Part 53: MEMS electrothermal transfer device
现行
ICS 31 电子学
2025
14 页
¥1
IEC 62047-6:2009
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
现行
ICS 31 电子学
2009
30 页
¥2
IEC 62047-7:2011
Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
现行
ICS 31 电子学
2011
56 页
¥3
IEC 62047-8:2011
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
现行
ICS 31 电子学
2011
36 页
¥2
IEC 62052-11:2020
Electricity metering equipment - General requirements, tests and test conditions - Part 11: Metering equipment
现行
ICS 17 计量学和测量、物理现象
2020
119 页
¥5