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IEC 62872-2:2022
Industrial-process measurement, control and automation - Part 2: Internet of Things (IoT) - Application framework for industrial facility demand response energy management
现行
ICS 27 能源和热传导工程
2022
108 页
¥5
IEC 62873-1:2017/AMD1:2020
Amendment 1 - Residual current operated circuit-breakers for household and similar use - Part 1: Outline of blocks and modules for residual current device standards
现行
ICS 29 电气工程
2017
13 页
¥1
IEC 62873-2:2016
Residual current operated circuit-breakers for household and similar use - Part 2: Residual current devices (RCDs) - Vocabulary
现行
ICS 29 电气工程
2016
30 页
¥2
IEC 62873-3-1:2020
Residual current operated circuit-breakers for household and similar use - Part 3-1: Particular requirements for devices with screwless-type terminals for external copper conductors
现行
ICS 29 电气工程
2020
15 页
¥1
IEC 62873-3-2:2020
Residual current operated circuit-breakers for household and similar use - Part 3-2: Particular requirements for devices with flat quick-connect terminations
现行
ICS 29 电气工程
2020
13 页
¥1
IEC 62873-3-3:2022 RLV
Residual current operated circuit-breakers for household and similar use - Part 3-3: Specific requirements for devices with screw-type terminals for external untreated aluminium conductors and with aluminium screw-type terminals for use with copper or with aluminium conductors
现行
ICS 29 电气工程
2022
41 页
¥3
IEC 62875:2015
Multimedia systems and equipment - Multimedia e-publishing and e-book technologies - Printing specification of texture map for auditory presentation of printed texts
现行
ICS 33 电信、音频和视频工程
2015
15 页
¥1
IEC 62877-1:2023 RLV
Electrolyte and water for vented lead acid accumulators - Part 1: Requirements for electrolyte
现行
ICS 29 电气工程
2023
39 页
¥2
IEC 62877-2:2016
Electrolyte and water for vented lead acid accumulators - Part 2: Requirements for water
现行
ICS 29 电气工程
2016
16 页
¥1
IEC 62878-1-1:2015
Device embedded substrate - Part 1-1: Generic specification - Test methods
现行
ICS 31 电子学
2015
109 页
¥5
IEC 62878-1:2019
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
现行
ICS 31 电子学
2019
19 页
¥1
IEC 62878-2-5:2019
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
现行
ICS 31 电子学
2019
53 页
¥3
IEC 62878-2-602:2021
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
现行
ICS 31 电子学
2021
24 页
¥2
IEC 62878-2-603:2025
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
现行
ICS 31 电子学
2025
25 页
¥2
IEC 62880-1:2017
Semiconductor devices - Stress migration test standard - Part 1: Copper stress migration test standard
现行
ICS 31 电子学
2017
24 页
¥2
IEC 62881:2018/COR1:2019
Corrigendum 1 - Cause and effect matrix
现行
ICS 25 机械制造
2018
2 页
¥1
IEC 62884-1:2017
Measurement techniques of piezoelectric, dieletric and electrostatic oscillators - Part 1: Basic methods for the measurement
现行
ICS 31 电子学
2017
61 页
¥5
IEC 62884-2:2017
Measurement techniques of piezoelectric, dieletric and electrostatic oscillators - Part 2: Phase jitter measurement method
现行
ICS 31 电子学
2017
24 页
¥2
IEC 62884-3:2018
Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 3: Frequency aging test methods
现行
ICS 31 电子学
2018
13 页
¥1
IEC 62884-4:2019
Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 4 : Short-term frequency stability test methods
现行
ICS 31 电子学
2019
40 页
¥2