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Organic light emitting diode (OLED) light sources for general lighting - Safety - Part 2-3: Particular requirements - Flexible OLED tiles and panels

Organic light emitting diode (OLED) light sources for general lighting - Safety - Part 2-4: Particular requirements - Rigid OLED tiles and panels

Organic light emitting diode (OLED) panels for general lighting - Safety requirements

Industrial-process measurement, control and automation - Part 2: Internet of Things (IoT) - Application framework for industrial facility demand response energy management

Amendment 1 - Residual current operated circuit-breakers for household and similar use - Part 1: Outline of blocks and modules for residual current device standards

Residual current operated circuit-breakers for household and similar use - Part 2: Residual current devices (RCDs) - Vocabulary

Residual current operated circuit-breakers for household and similar use - Part 3-1: Particular requirements for devices with screwless-type terminals for external copper conductors

Residual current operated circuit-breakers for household and similar use - Part 3-2: Particular requirements for devices with flat quick-connect terminations

Residual current operated circuit-breakers for household and similar use - Part 3-3: Specific requirements for devices with screw-type terminals for external untreated aluminium conductors and with aluminium screw-type terminals for use with copper or with aluminium conductors

Multimedia systems and equipment - Multimedia e-publishing and e-book technologies - Printing specification of texture map for auditory presentation of printed texts

Electrolyte and water for vented lead acid accumulators - Part 1: Requirements for electrolyte

Electrolyte and water for vented lead acid accumulators - Part 2: Requirements for water

Device embedded substrate - Part 1-1: Generic specification - Test methods

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity

Semiconductor devices - Stress migration test standard - Part 1: Copper stress migration test standard

Corrigendum 1 - Cause and effect matrix

Measurement techniques of piezoelectric, dieletric and electrostatic oscillators - Part 1: Basic methods for the measurement