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IEC 60747-14-10:2019
Semiconductor devices - Part 14-10: Semiconductor sensors - Performance evaluation methods for wearable glucose sensors
现行
ICS 31 电子学
2019
64 页
¥5
IEC 60747-14-11:2021
Semiconductor devices - Part 14-11: Semiconductor sensors - Test method of surface acoustic wave-based integrated sensors for measuring ultraviolet, illumination and temperature
现行
ICS 31 电子学
2021
21 页
¥2
IEC 60747-14-1:2010
Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
现行
ICS 31 电子学
2010
42 页
¥3
IEC 60747-14-2:2000
Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
现行
ICS 31 电子学
2000
14 页
¥1
IEC 60747-14-3:2009
Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
现行
ICS 31 电子学
2009
37 页
¥2
IEC 60747-14-4:2011
Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
现行
ICS 31 电子学
2011
197 页
¥5
IEC 60747-14-5:2010
Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
现行
ICS 31 电子学
2010
37 页
¥2
IEC 60747-15:2024 RLV
Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices
现行
ICS 31 电子学
2024
176 页
¥5
IEC 60747-16-10:2004
Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits
现行
ICS 31 电子学
2004
56 页
¥3
IEC 60747-16-11:2026
Semiconductor devices - Part 16-11: Microwave integrated circuits - Power detectors
现行
ICS 31 电子学
2026
36 页
¥2
IEC 60747-16-5:2013/AMD1:2020/COR1:2020
Corrigendum 1 - Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
现行
ICS 31 电子学
2013
1 页
¥1
IEC 60747-16-6:2019
Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers
现行
ICS 31 电子学
2019
50 页
¥3
IEC 60747-16-7:2022
Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators
现行
ICS 31 电子学
2022
83 页
¥5
IEC 60747-16-8:2022
Semiconductor devices - Part 16-8: Microwave integrated circuits - Limiters
现行
ICS 31 电子学
2022
73 页
¥5
IEC 60747-17:2020/COR1:2021
Corrigendum 1 - Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation
现行
ICS 31 电子学
2020
1 页
¥1
IEC 60747-18-1:2019
Semiconductor devices - Part 18-1: Semiconductor bio sensors - Test method and data analysis for calibration of lens-free CMOS photonic array sensors
现行
ICS 31 电子学
2019
26 页
¥2
IEC 60747-18-2:2020
Semiconductor devices - Part 18-2: Semiconductor bio sensors - Evaluation process of lens-free CMOS photonic array sensor package modules
现行
ICS 31 电子学
2020
18 页
¥1
IEC 60747-18-3:2019
Semiconductor devices - Part 18-3: Semiconductor bio sensors - Fluid flow characteristics of lens-free CMOS photonic array sensor package modules with fluidic system
现行
ICS 31 电子学
2019
22 页
¥2
IEC 60747-18-4:2023
Semiconductor devices - Part 18-4: Semiconductor bio sensors - Evaluation method of noise characteristics of lens-free CMOS photonic array sensors
现行
ICS 31 电子学
2023
14 页
¥1
IEC 60747-18-5:2023
Semiconductor devices - Part 18-5: Semiconductor bio sensors - Evaluation method for light responsivity characteristics of lens-free CMOS photonic array sensor package modules by incident angle of light
现行
ICS 31 电子学
2023
12 页
¥1