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IEC 60749-12:2017
Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
现行 ICS 31 电子学 2017 14 页 ¥1
IEC 60749-13:2018
Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
现行 ICS 31 电子学 2018 28 页 ¥2
IEC 60749-15:2020
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
现行 ICS 31 电子学 2020 17 页 ¥1
IEC 60749-17:2019
Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
现行 ICS 31 电子学 2019 17 页 ¥1
IEC 60749-18:2019 RLV
Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
现行 ICS 31 电子学 2019 66 页 ¥5
IEC 60749-20-1:2019
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
现行 ICS 31 电子学 2019 82 页 ¥5
IEC 60749-20:2020
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
现行 ICS 31 电子学 2020 55 页 ¥3
IEC 60749-21:2011
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
现行 ICS 31 电子学 2011 44 页 ¥3
IEC 60749-21:2025 RLV
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
现行 ICS 31 电子学 2025 61 页 ¥5
IEC 60749-22-1:2025
Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods
现行 ICS 31 电子学 2025 128 页 ¥5
IEC 60749-22-2:2025
Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods
现行 ICS 31 电子学 2025 72 页 ¥5
IEC 60749-23:2025 RLV
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
现行 ICS 31 电子学 2025 29 页 ¥2
IEC 60749-24:2004
Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
现行 ICS 31 电子学 2004 19 页 ¥1
IEC 60749-24:2025
Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
现行 ICS 31 电子学 2025 18 页 ¥1
IEC 60749-26:2018
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
现行 ICS 31 电子学 2018 106 页 ¥5
IEC 60749-26:2025 CMV
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
现行 ICS 31 电子学 2025 171 页 ¥5
IEC 60749-28:2022
Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
现行 ICS 31 电子学 2022 98 页 ¥5
IEC 60749-30:2020 RLV
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
现行 ICS 31 电子学 2020 41 页 ¥3
IEC 60749-33:2004
Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
现行 ICS 31 电子学 2004 17 页 ¥1
IEC 60749-34-1:2025
Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module
现行 ICS 31 电子学 2025 56 页 ¥3