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IEC 60749-12:2017
Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
现行
ICS 31 电子学
2017
14 页
¥1
IEC 60749-13:2018
Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
现行
ICS 31 电子学
2018
28 页
¥2
IEC 60749-15:2020
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
现行
ICS 31 电子学
2020
17 页
¥1
IEC 60749-17:2019
Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
现行
ICS 31 电子学
2019
17 页
¥1
IEC 60749-18:2019 RLV
Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
现行
ICS 31 电子学
2019
66 页
¥5
IEC 60749-20-1:2019
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
现行
ICS 31 电子学
2019
82 页
¥5
IEC 60749-20:2020
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
现行
ICS 31 电子学
2020
55 页
¥3
IEC 60749-21:2011
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
现行
ICS 31 电子学
2011
44 页
¥3
IEC 60749-21:2025 RLV
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
现行
ICS 31 电子学
2025
61 页
¥5
IEC 60749-22-1:2025
Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods
现行
ICS 31 电子学
2025
128 页
¥5
IEC 60749-22-2:2025
Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods
现行
ICS 31 电子学
2025
72 页
¥5
IEC 60749-23:2025 RLV
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
现行
ICS 31 电子学
2025
29 页
¥2
IEC 60749-24:2004
Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
现行
ICS 31 电子学
2004
19 页
¥1
IEC 60749-24:2025
Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
现行
ICS 31 电子学
2025
18 页
¥1
IEC 60749-26:2018
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
现行
ICS 31 电子学
2018
106 页
¥5
IEC 60749-26:2025 CMV
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
现行
ICS 31 电子学
2025
171 页
¥5
IEC 60749-28:2022
Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
现行
ICS 31 电子学
2022
98 页
¥5
IEC 60749-30:2020 RLV
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
现行
ICS 31 电子学
2020
41 页
¥3
IEC 60749-33:2004
Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
现行
ICS 31 电子学
2004
17 页
¥1
IEC 60749-34-1:2025
Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module
现行
ICS 31 电子学
2025
56 页
¥3