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Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits

Semiconductor devices. Integrated circuits - Part 3: Analogue integrated circuits - Section one: Blank detail specification for monolithic integrated operational amplifiers

Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 1: Blank detail specification for linear digital-to-analogue converters (DAC)

Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 2: Blank detail specification for linear analogue-to-digital converters (ADC)

Semiconductor devices - Integrated circuits - Part 4-3: Interface integrated circuits - Dynamic criteria for analogue-digital converters (ADC)

Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits

Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly

Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency

Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation

Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods

Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods

Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST