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IEC 60749-24:2025
Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
现行 ICS 31 电子学 2025 18 页 ¥1
IEC 60749-26:2018
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
现行 ICS 31 电子学 2018 106 页 ¥5
IEC 60749-26:2025 CMV
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
现行 ICS 31 电子学 2025 171 页 ¥5
IEC 60749-28:2022
Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
现行 ICS 31 电子学 2022 98 页 ¥5
IEC 60749-30:2020 RLV
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
现行 ICS 31 电子学 2020 41 页 ¥3
IEC 60749-33:2004
Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
现行 ICS 31 电子学 2004 17 页 ¥1
IEC 60749-34-1:2025
Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module
现行 ICS 31 电子学 2025 56 页 ¥3
IEC 60749-34:2010
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
现行 ICS 31 电子学 2010 21 页 ¥2
IEC 60749-35:2006
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
现行 ICS 31 电子学 2006 43 页 ¥3
IEC 60749-36:2003
Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state
现行 ICS 31 电子学 2003 7 页 ¥1
IEC 60749-37:2022 RLV
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
现行 ICS 31 电子学 2022 67 页 ¥5
IEC 60749-38:2008
Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
现行 ICS 31 电子学 2008 26 页 ¥2
IEC 60749-39:2021
Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
现行 ICS 31 电子学 2021 25 页 ¥2
IEC 60749-3:2017
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
现行 ICS 31 电子学 2017 11 页 ¥1
IEC 60749-40:2011
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
现行 ICS 31 电子学 2011 44 页 ¥3
IEC 60749-41:2020
Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices
现行 ICS 31 电子学 2020 44 页 ¥3
IEC 60749-42:2014
Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
现行 ICS 31 电子学 2014 16 页 ¥1
IEC 60749-43:2017
Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
被代替 ICS 31 电子学 2017 74 页 ¥5
IEC 60749-44:2016
Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
现行 ICS 31 电子学 2016 41 页 ¥3
IEC 60749-4:2017
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
现行 ICS 31 电子学 2017 9 页 ¥1