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IEC 60749-24:2025
Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
现行
ICS 31 电子学
2025
18 页
¥1
IEC 60749-26:2018
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
现行
ICS 31 电子学
2018
106 页
¥5
IEC 60749-26:2025 CMV
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
现行
ICS 31 电子学
2025
171 页
¥5
IEC 60749-28:2022
Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
现行
ICS 31 电子学
2022
98 页
¥5
IEC 60749-30:2020 RLV
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
现行
ICS 31 电子学
2020
41 页
¥3
IEC 60749-33:2004
Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
现行
ICS 31 电子学
2004
17 页
¥1
IEC 60749-34-1:2025
Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module
现行
ICS 31 电子学
2025
56 页
¥3
IEC 60749-34:2010
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
现行
ICS 31 电子学
2010
21 页
¥2
IEC 60749-35:2006
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
现行
ICS 31 电子学
2006
43 页
¥3
IEC 60749-36:2003
Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state
现行
ICS 31 电子学
2003
7 页
¥1
IEC 60749-37:2022 RLV
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
现行
ICS 31 电子学
2022
67 页
¥5
IEC 60749-38:2008
Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
现行
ICS 31 电子学
2008
26 页
¥2
IEC 60749-39:2021
Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
现行
ICS 31 电子学
2021
25 页
¥2
IEC 60749-3:2017
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
现行
ICS 31 电子学
2017
11 页
¥1
IEC 60749-40:2011
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
现行
ICS 31 电子学
2011
44 页
¥3
IEC 60749-41:2020
Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices
现行
ICS 31 电子学
2020
44 页
¥3
IEC 60749-42:2014
Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
现行
ICS 31 电子学
2014
16 页
¥1
IEC 60749-43:2017
Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
被代替
ICS 31 电子学
2017
74 页
¥5
IEC 60749-44:2016
Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
现行
ICS 31 电子学
2016
41 页
¥3
IEC 60749-4:2017
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
现行
ICS 31 电子学
2017
9 页
¥1