ICS 31
电子学
共 1,114 项 ISO/IEC 标准 · 合计 18.6 GB · 分 56 页展示
二级分类
IEC 60749-20-1:2019
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount…
现行
31.080 半导体分立器件
2019
82 页
¥5
IEC 60749-20:2020
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of…
现行
31.080 半导体分立器件
2020
55 页
¥3
IEC 60749-21:2011
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
现行
31.080 半导体分立器件
2011
44 页
¥3
IEC 60749-21:2025 RLV
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
现行
31.080 半导体分立器件
2025
61 页
¥5
IEC 60749-22-1:2025
Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods
现行
31.080 半导体分立器件
2025
128 页
¥5
IEC 60749-22-2:2025
Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods
现行
31.080 半导体分立器件
2025
72 页
¥5
IEC 60749-23:2025 RLV
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
现行
31.080 半导体分立器件
2025
29 页
¥2
IEC 60749-24:2004
Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
现行
31.080 半导体分立器件
2004
19 页
¥1
IEC 60749-24:2025
Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
现行
31.080 半导体分立器件
2025
18 页
¥1
IEC 60749-26:2018
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body…
现行
31.080 半导体分立器件
2018
106 页
¥5
IEC 60749-26:2025 CMV
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body…
现行
31.080 半导体分立器件
2025
171 页
¥5
IEC 60749-28:2022
Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device…
现行
31.080 半导体分立器件
2022
98 页
¥5
IEC 60749-30:2020 RLV
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to…
现行
31.080 半导体分立器件
2020
41 页
¥3
IEC 60749-33:2004
Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
现行
31.080 半导体分立器件
2004
17 页
¥1
IEC 60749-34-1:2025
Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module
现行
31.080 半导体分立器件
2025
56 页
¥3
IEC 60749-34:2010
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
现行
31.080 半导体分立器件
2010
21 页
¥2
IEC 60749-35:2006
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
现行
31.080 半导体分立器件
2006
43 页
¥3
IEC 60749-36:2003
Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state
现行
31.080 半导体分立器件
2003
7 页
¥1
IEC 60749-37:2022 RLV
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
现行
31.080 半导体分立器件
2022
67 页
¥5
IEC 60749-38:2008
Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
现行
31.080 半导体分立器件
2008
26 页
¥2
关于 ICS 31 电子学
ICS 31 是 ICS 分类法中的一级大类，中文名称"电子学"，本站收录该分类下的 ISO 与 IEC 国际标准共 1,114 项，覆盖 14 个二级类目。
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